This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...