TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies ...

SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new single-chip Bluetoothâ„¢ large scale integration (LSI) that integrates radio frequency ...

Announced at ISSCC 2022: Impedance Tuning and Reference Signal Self-Correction Technologies Can Facilitate Bluetooth LE Implementation in IoT Devices TOKYO, Japan ― February 24, 2022 -- Renesas ...

A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead of the usual bipolar ...