What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and accelerators closer together, 3D-ICs overcome data-movement bottlenecks and ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

At the IEEE International Electron Device Meeting (IEDM) 2022, Intel unveiled research breakthroughs in 2D and 3D IC packaging technologies fueling its innovation pipeline for keeping its promises to ...

Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (SNPS), (NASDAQ: SNPS) today announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate ...

HSINCHU, Taiwan--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the Open Innovation Platform ® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC ...