Intel was first to market with backside power delivery.

Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications SANTA CLARA, Calif.--(BUSINESS WIRE)-- TSMC (TWSE: 2330, NYSE: TSM) today unveiled its ...

Xiaomi’s second-generation in-house flagship mobile processor, Xring O2, will be manufactured using TSMC’s 3-nanometre N3P ...

A smaller version of existing 16nm technology According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes… A ...

Accelerates Pathway to Ultra High-Speed 1.6Tbps Bandwidth for Build Out of the Next Generation of Cloud Computing, AI, and Hyperscale Networks SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the upcoming ...

Apple manufacturing partner TSMC has announced its next logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s ...

Core Architecture: Unlike its predecessor, the Snapdragon 8 Elite Gen5, which employed a 2+6 cluster architecture, the new series will adopt a 2+3+3 octa-core architecture. This configuration is ...

TSMC reported record Q4 profit and raised 2026 capex guidance to $52–$56 billion as CEO C.C. Wei confirmed progress on ...

Intel (INTC) reported earnings yesterday afternoon, and while results beat expectations on both the top and bottom line, the ...