Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Researchers are creating a new high speed environmentally-friendly packaging process that will use recycled materials and reduce the amount of plastic used, cutting the waste that goes into landfill.

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

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SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...

The scientists used sliced bologna tainted with Listeria monocytogenes, packaged it in vacuum-sealed plastic bags, and then submerged the packages in hot water, said lead researcher Tim Haley of ...